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公开(公告)号:US10388556B2
公开(公告)日:2019-08-20
申请号:US15302419
申请日:2015-04-10
Applicant: LINTEC CORPORATION
Inventor: Yuki Morita , Yosuke Saito , Shigeto Okuji
IPC: H01L21/683 , B32B27/30 , B32B27/40 , C09J7/29
Abstract: A substrate for back grind tape of the present invention includes a substrate film having a Young's modulus of 600 MPa or more; and a buffer layer provided on one face of the substrate film, the buffer layer formed of a urethane-containing cured material and having a peak temperature of tan δ of 60° C. or lower.
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公开(公告)号:US10253222B2
公开(公告)日:2019-04-09
申请号:US15112374
申请日:2014-12-03
Applicant: LINTEC CORPORATION
Inventor: Sayaka Enoki , Yuki Morita
IPC: C09J7/02 , C09J133/10 , H01L21/683 , C09J7/38 , C09J7/29
Abstract: There is provided a pressure sensitive adhesive sheet for wafer protection (1a) comprising a base material (11), an intermediate layer (12), and a pressure sensitive adhesive layer (13) in this order, wherein the intermediate layer is a layer formed from an intermediate layer-forming composition containing 100 parts by mass of a non-energy ray-curable acrylic polymer (A) and 25 parts by mass or more of an energy ray-curable acrylic polymer (B) having a mass average molecular weight of 50,000 to 250,000; and the pressure sensitive adhesive layer is a layer formed from a pressure sensitive adhesive composition containing an energy ray-curable acrylic polymer (C). The inventive pressure sensitive adhesive sheet for wafer protection is excellent in interfacial adhesion between an intermediate layer and a pressure sensitive adhesive layer after energy ray irradiation. Therefore, the pressure sensitive adhesive sheet for wafer protection can suppress the deposition of a residue of the pressure sensitive adhesive layer to an adherend when it is removed after laminated to the adherend, has excellent followability even to an adherend having a large unevenness difference on a wafer surface, and has a small rate of change of adhesive strength even after being stored for a long period of time and has excellent stability with time.
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