Adhesive sheet for wafer protection

    公开(公告)号:US10253222B2

    公开(公告)日:2019-04-09

    申请号:US15112374

    申请日:2014-12-03

    Abstract: There is provided a pressure sensitive adhesive sheet for wafer protection (1a) comprising a base material (11), an intermediate layer (12), and a pressure sensitive adhesive layer (13) in this order, wherein the intermediate layer is a layer formed from an intermediate layer-forming composition containing 100 parts by mass of a non-energy ray-curable acrylic polymer (A) and 25 parts by mass or more of an energy ray-curable acrylic polymer (B) having a mass average molecular weight of 50,000 to 250,000; and the pressure sensitive adhesive layer is a layer formed from a pressure sensitive adhesive composition containing an energy ray-curable acrylic polymer (C). The inventive pressure sensitive adhesive sheet for wafer protection is excellent in interfacial adhesion between an intermediate layer and a pressure sensitive adhesive layer after energy ray irradiation. Therefore, the pressure sensitive adhesive sheet for wafer protection can suppress the deposition of a residue of the pressure sensitive adhesive layer to an adherend when it is removed after laminated to the adherend, has excellent followability even to an adherend having a large unevenness difference on a wafer surface, and has a small rate of change of adhesive strength even after being stored for a long period of time and has excellent stability with time.

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