公开(公告)号：US20210244332A1

公开(公告)日：2021-08-12

申请号：US16972942

申请日：2019-05-28

Applicant: LINTEC CORPORATION

Inventor： Yoshiaki Hagihara ,  Shigeto Okuji

IPC: A61B5/27 ,  A61B5/256

Abstract: Disclosed is an electrode-wiring-equipped cloth material including: a cloth material main body; an electrode section which is provided on a surface of or inside the cloth material main body and contains a conductive linear body; a wiring section which is provided adjacent to the electrode section on the surface of or inside the cloth material main body and contains a conductive linear body, in which cloth material at least one conductive linear body contained in the electrode section and at least on conductive linear body contained in the wiring section are the same single conductive linear body.

公开(公告)号：US20210187788A1

公开(公告)日：2021-06-24

申请号：US17059317

申请日：2019-05-28

Applicant: LINTEC CORPORATION

Inventor： Yoshiaki Hagihara ,  Shigeto Okuji

IPC: B29B11/16 ,  B29C70/22

Abstract: Disclosed is a method of producing a carbon-resin composite material, the method including: the step of preparing a composite structure in which a carbon linear body containing a carbon material, and a resin linear body containing at least one of a thermoplastic resin or a thermosetting resin are regularly arranged; and the step of heating the composite structure.

公开(公告)号：US12114981B2

公开(公告)日：2024-10-15

申请号：US16972942

申请日：2019-05-28

Applicant: LINTEC CORPORATION

Inventor： Yoshiaki Hagihara ,  Shigeto Okuji

IPC: A61B5/27 ,  A61B5/00 ,  A61B5/256 ,  D03D1/00 ,  D03D15/00 ,  D03D15/533 ,  D03D15/67 ,  D04B1/14 ,  H05K1/11 ,  H05K3/10

CPC classification number: A61B5/27 ,  A61B5/256 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/533 ,  D03D15/67 ,  D04B1/14 ,  H05K1/11 ,  H05K3/103 ,  A61B5/6804 ,  A61B2562/0209 ,  D05D2303/40 ,  D10B2401/16 ,  D10B2403/02431

Abstract: Disclosed is an electrode-wiring-equipped cloth material including: a cloth material main body; an electrode section which is provided on a surface of or inside the cloth material main body and contains a conductive linear body; a wiring section which is provided adjacent to the electrode section on the surface of or inside the cloth material main body and contains a conductive linear body, in which cloth material at least one conductive linear body contained in the electrode section and at least on conductive linear body contained in the wiring section are the same single conductive linear body.

公开(公告)号：US20170323820A1

公开(公告)日：2017-11-09

申请号：US15520121

申请日：2015-10-21

Applicant: LINTEC Corporation

Inventor： Kazuyuki Tamura ,  Shigeto Okuji

IPC: H01L21/683 ,  G06K19/077 ,  C09J7/02

CPC classification number: H01L21/6835 ,  B32B7/04 ,  B32B25/08 ,  B32B25/14 ,  B32B27/00 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/38 ,  B32B27/40 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2307/21 ,  B32B2307/4026 ,  B32B2307/50 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/14 ,  C08K2201/001 ,  C09J7/20 ,  C09J7/25 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/006 ,  C09J2475/006 ,  G06K19/077 ,  H01L21/304 ,  H01L21/683 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

公开(公告)号：US12104292B2

公开(公告)日：2024-10-01

申请号：US17286588

申请日：2019-10-22

Applicant: LINTEC CORPORATION

Inventor： Yoshiaki Hagihara ,  Shigeto Okuji

IPC: D03D1/00 ,  A41D1/00 ,  A41D31/18 ,  D03D15/533 ,  D03D15/56

CPC classification number: D03D1/0088 ,  A41D1/002 ,  A41D31/185 ,  D03D15/533 ,  D03D15/56 ,  D10B2401/061 ,  D10B2401/16 ,  D10B2401/18

Abstract: A fabric material with an electrode wiring includes: a fabric material body with stretchability; a first electrode portion that is disposed on a surface or in the interior of the fabric material body, and that includes a conductive linear body; a first wiring portion that is disposed on the surface or in the interior of the fabric material body so as to be electrically connected to the first electrode portion, and that includes a conductive linear body; a second electrode portion that is disposed on the surface or in the interior of the fabric material body, and that includes a conductive linear body; and a second wiring portion that is disposed on the surface or in the interior of the fabric material body so as to be electrically connected to the second electrode portion, and that includes a conductive linear body. In the fabric material with an electrode wiring, a resistance value between the first electrode portion and the second electrode portion is varied by stretching the fabric material with an electrode wiring.

公开(公告)号：US10315394B2

公开(公告)日：2019-06-11

申请号：US15519059

申请日：2015-10-19

Applicant: LINTEC CORPORATION

Inventor： Keishi Fuse ,  Kazuyuki Tamura ,  Shigeto Okuji

IPC: B32B27/20 ,  B32B27/30 ,  B32B27/40 ,  B32B27/18 ,  H01L21/683 ,  C09J7/25 ,  B32B7/04 ,  B32B25/08 ,  B32B27/06 ,  B32B27/08 ,  B32B27/24 ,  B32B27/28 ,  B32B7/05

Abstract: The substrate for surface protective sheet of the present invention is a substrate for surface protective sheet including a support film and an antistatic layer provided on one face of the support film, wherein a stress relaxation rate of the substrate for surface protective sheet is 60% or more; the antistatic layer is one formed by curing an antistatic layer-forming composition containing a curing component and a metal filler; and the content of a metal filler is 55 mass % or more relative to the total mass of the curing component and the metal filler, and the curing component includes a urethane acrylate oligomer.

公开(公告)号：US10224230B2

公开(公告)日：2019-03-05

申请号：US15520121

申请日：2015-10-21

Applicant: LINTEC Corporation

Inventor： Kazuyuki Tamura ,  Shigeto Okuji

IPC: H01L21/683 ,  B32B27/00 ,  B32B27/18 ,  H01L21/304 ,  C09J7/29 ,  C09J7/20 ,  C09J7/38 ,  G06K19/077 ,  C09J7/25 ,  B32B7/04 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/16 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  B32B27/38 ,  B32B27/40

Abstract: A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

公开(公告)号：US10388556B2

公开(公告)日：2019-08-20

申请号：US15302419

申请日：2015-04-10

Applicant: LINTEC CORPORATION

Inventor： Yuki Morita ,  Yosuke Saito ,  Shigeto Okuji

IPC: H01L21/683 ,  B32B27/30 ,  B32B27/40 ,  C09J7/29

Abstract: A substrate for back grind tape of the present invention includes a substrate film having a Young's modulus of 600 MPa or more; and a buffer layer provided on one face of the substrate film, the buffer layer formed of a urethane-containing cured material and having a peak temperature of tan δ of 60° C. or lower.