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公开(公告)号：US10388556B2
公开(公告)日：2019-08-20
申请号：US15302419
申请日：2015-04-10
Applicant: LINTEC CORPORATION
Inventor： Yuki Morita , Yosuke Saito , Shigeto Okuji
IPC: H01L21/683 , B32B27/30 , B32B27/40 , C09J7/29
Abstract: A substrate for back grind tape of the present invention includes a substrate film having a Young's modulus of 600 MPa or more; and a buffer layer provided on one face of the substrate film, the buffer layer formed of a urethane-containing cured material and having a peak temperature of tan δ of 60° C. or lower.
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