Invention Grant
- Patent Title: Semiconductor devices including conductive lines and methods of forming the semiconductor devices
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Application No.: US15842432Application Date: 2017-12-14
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Publication No.: US10388601B2Publication Date: 2019-08-20
- Inventor: William R. Brown , Jenna L. Russon , Tim H. Bossart , Brian R. Watson , Nikolay A. Mirin , David A. Kewley
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L27/02 ; H01L27/11519 ; G01R1/073 ; G01R31/26 ; H01L21/66 ; H01L49/02 ; H01L21/033 ; H01L21/768 ; H01L23/528 ; H01L27/108 ; H01L21/3213 ; H01L27/11582
Abstract:
A semiconductor device including conductive lines is disclosed. First conductive lines each comprise a first portion, a second portion, and an enlarged portion, the enlarged portion connecting the first portion and the second portion of the first conductive line. The semiconductor device includes second conductive lines, at least some of the second conductive lines disposed between a pair of the first conductive lines, each second conductive line including a larger cross-sectional area at an end portion of the second conductive line than at other portions thereof. The semiconductor device includes a pad on each of the first conductive lines and the second conductive lines, wherein the pad on each of the second conductive lines is on the end portion thereof and the pad on each of the first conductive lines is on the enlarged portion thereof.
Public/Granted literature
- US20180114751A1 SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE LINES AND METHODS OF FORMING THE SEMICONDUCTOR DEVICES Public/Granted day:2018-04-26
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