- Patent Title: Semiconductor chip and method for producing a semiconductor chip
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Application No.: US15594519Application Date: 2017-05-12
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Publication No.: US10388823B2Publication Date: 2019-08-20
- Inventor: Alfred Lell , Andreas Loeffler , Christoph Eichler , Bernhard Stojetz , Andre Somers
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: McDermott Will & Emery LLP
- Priority: DE102016108891 20160513
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/67 ; H01L33/62 ; H01L21/687 ; H01L33/26 ; H01L33/32 ; H01S5/32 ; H01S5/10 ; H01S5/40 ; H01S5/22 ; H01S5/323 ; H01S5/026 ; H01S5/20 ; H01S5/227
Abstract:
A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).
Public/Granted literature
- US20170330996A1 SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMICONDUCTOR CHIP Public/Granted day:2017-11-16
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