Invention Grant
- Patent Title: Pattern forming method and method for manufacturing electronic device
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Application No.: US15718659Application Date: 2017-09-28
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Publication No.: US10394127B2Publication Date: 2019-08-27
- Inventor: Wataru Nihashi , Hideaki Tsubaki , Toru Tsuchihashi , Tomotaka Tsuchimura
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-074229 20150331
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/32 ; G03F7/038 ; G03F7/16 ; G03F7/039

Abstract:
Provide are a pattern forming method including a step (1) of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition including a resin having an acid-decomposable repeating unit capable of decomposing by the action of an acid to generate an acid having a pKa of 3.0 or less, a step (2) of exposing the film using actinic rays or radiation, and a step (3) of carrying out development using a developer including an organic solvent after the exposure to form a negative tone pattern; and a method for manufacturing an electronic device, including the pattern forming method.
Public/Granted literature
- US20180017872A1 PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2018-01-18
Information query
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