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    Treatment liquid and pattern forming method
    4.
    发明授权
    Treatment liquid and pattern forming method 有权

    公开(公告)号：US11042094B2

    公开(公告)日：2021-06-22

    申请号：US15937873

    申请日：2018-03-28

    Applicant: FUJIFILM Corporation

    Inventor： Shuji Hirano ,  Hideaki Tsubaki ,  Toru Tsuchihashi ,  Wataru Nihashi ,  Kei Yamamoto

    IPC: G03F7/32 ,  G03F7/40 ,  G03F7/20 ,  G03F7/004 ,  G03F7/039 ,  G03F7/095 ,  G03F7/075 ,  G03F7/11 ,  G03F7/038

    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can simultaneously suppress the occurrence of pattern collapse in a resist L/S pattern and the occurrence of omission failure in a resist C/H pattern.
    The treatment liquid of the present invention is a treatment liquid for patterning a resist film, which is used for subjecting a resist film obtained from an actinic ray-sensitive or radiation-sensitive resin composition to at least one of development or washing, and contains an organic solvent, in which the treatment liquid contains a first organic solvent having a relative dielectric constant of 4.0 or less and a second organic solvent having a relative dielectric constant of 6.0 or more.

    Pattern forming method, method for manufacturing electronic device, and laminate
    5.
    发明授权
    Pattern forming method, method for manufacturing electronic device, and laminate 有权

    公开(公告)号：US10663864B2

    公开(公告)日：2020-05-26

    申请号：US15904438

    申请日：2018-02-26

    Applicant: FUJIFILM Corporation

    Inventor： Wataru Nihashi ,  Hideaki Tsubaki ,  Toru Tsuchihashi ,  Kei Yamamoto

    IPC: G03F7/11 ,  G03F7/40 ,  G03F7/32 ,  G03F7/20 ,  G03F7/38 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075

    Abstract: The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film using a composition for forming an upper layer film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer, in which the composition for forming an upper layer film includes a solvent and a crosslinking agent; and in which the content of a solvent having a hydroxyl group is 80% by mass or less with respect to all the solvents included in the composition for forming an upper layer film. The method for manufacturing an electronic device includes the pattern forming method. The laminate has an actinic ray-sensitive or radiation-sensitive film, and an upper layer film including a crosslinking agent.

    Pattern forming method and electronic device manufacturing method
    9.
    发明授权
    Pattern forming method and electronic device manufacturing method 有权

    公开(公告)号：US10788754B2

    公开(公告)日：2020-09-29

    申请号：US15853973

    申请日：2017-12-26

    Applicant: FUJIFILM Corporation

    Inventor： Wataru Nihashi ,  Toru Tsuchihashi ,  Hideaki Tsubaki

    IPC: G03F7/32 ,  G03F7/20 ,  G03F7/039 ,  G03F7/038 ,  G03F7/004

    Abstract: Provided are a positive tone pattern forming method in which development is carried out using a developer containing an organic solvent with use of a composition containing (A) a resin which has a repeating unit containing a moiety capable of forming a polar interaction and whose polarity is decreased due to release of the polar interaction by the action of an acid or a base, or a composition containing (A′) a resin having a repeating unit containing a polar group and (B) a compound capable of forming a polar interaction with the polar group of the resin (A′); and an electronic device manufacturing method including such a pattern forming method.

    Pattern forming method, method for manufacturing electronic device, and laminate
    10.
    发明授权
    Pattern forming method, method for manufacturing electronic device, and laminate 有权

    公开(公告)号：US10761426B2

    公开(公告)日：2020-09-01

    申请号：US15904439

    申请日：2018-02-26

    Applicant: FUJIFILM Corporation

    Inventor： Hideaki Tsubaki ,  Wataru Nihashi ,  Toru Tsuchihashi ,  Kei Yamamoto

    IPC: G03F7/038 ,  G03F7/11 ,  G03F7/039 ,  G03F7/09 ,  G03F7/32 ,  G03F7/075 ,  H01L21/027 ,  G03F7/095

    Abstract: The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the composition for forming an upper layer film includes a resin and at least one of a compound capable of generating an acid with actinic rays or radiation, a compound capable of generating an acid with heat, and an acid, in which the resin includes a repeating unit represented by General Formula (II). The method for manufacturing an electronic device includes the pattern forming method. A laminate includes the film and the upper layer film.

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