Invention Grant
- Patent Title: Amorphous seed layer for improved stability in perpendicular STTM stack
-
Application No.: US15503359Application Date: 2014-09-26
-
Publication No.: US10395707B2Publication Date: 2019-08-27
- Inventor: Mark L. Doczy , Kaan Oguz , Brian S. Doyle , Charles C. Kuo , Robert S. Chau , Satyarth Suri
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2014/057865 WO 20140926
- International Announcement: WO2016/048376 WO 20160331
- Main IPC: H01L43/10
- IPC: H01L43/10 ; H01L43/12 ; G11C11/16 ; H01F10/32 ; H01L27/22

Abstract:
A material layer stack for a magnetic tunneling junction, the material layer stack including a fixed magnetic layer; a dielectric layer; a free magnetic layer; and an amorphous electrically-conductive seed layer, wherein the fixed magnetic layer is disposed between the dielectric layer and the seed layer. A non-volatile memory device including a material stack including an amorphous electrically-conductive seed layer; and a fixed magnetic layer juxtaposed and in contact with the seed layer. A method including forming an amorphous seed layer on a first electrode of a memory device; forming a material layer stack on the amorphous seed layer, the material stack including a dielectric layer disposed between a fixed magnetic layer and a free magnetic layer, wherein the fixed magnetic layer.
Public/Granted literature
- US20170345476A1 AMORHPOUS SEED LAYER FOR IMPROVED STABILITY IN PERPENDICULAR STTM STACK Public/Granted day:2017-11-30
Information query
IPC分类: