- 专利标题: Amorphous seed layer for improved stability in perpendicular STTM stack
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申请号: US15503359申请日: 2014-09-26
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公开(公告)号: US10395707B2公开(公告)日: 2019-08-27
- 发明人: Mark L. Doczy , Kaan Oguz , Brian S. Doyle , Charles C. Kuo , Robert S. Chau , Satyarth Suri
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 国际申请: PCT/US2014/057865 WO 20140926
- 国际公布: WO2016/048376 WO 20160331
- 主分类号: H01L43/10
- IPC分类号: H01L43/10 ; H01L43/12 ; G11C11/16 ; H01F10/32 ; H01L27/22
摘要:
A material layer stack for a magnetic tunneling junction, the material layer stack including a fixed magnetic layer; a dielectric layer; a free magnetic layer; and an amorphous electrically-conductive seed layer, wherein the fixed magnetic layer is disposed between the dielectric layer and the seed layer. A non-volatile memory device including a material stack including an amorphous electrically-conductive seed layer; and a fixed magnetic layer juxtaposed and in contact with the seed layer. A method including forming an amorphous seed layer on a first electrode of a memory device; forming a material layer stack on the amorphous seed layer, the material stack including a dielectric layer disposed between a fixed magnetic layer and a free magnetic layer, wherein the fixed magnetic layer.
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