Invention Grant
- Patent Title: Substrate treating apparatus and substrate treating method
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Application No.: US15854198Application Date: 2017-12-26
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Publication No.: US10395930B2Publication Date: 2019-08-27
- Inventor: Youngje Um
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-Do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Carter, Deluca & Farrell LLP
- Priority: KR10-2016-0184131 20161230; KR10-2017-0038216 20170327
- Main IPC: H01L21/263
- IPC: H01L21/263 ; H01L21/67
Abstract:
Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a chamber providing an interior space for treating a substrate, a support unit provided in the chamber and configured to support the substrate, a first ejection unit having a first nozzle configured to supply a first cleaning medium in an aerosol state to the substrate supported by the support unit, and a second ejection unit having a second nozzle configured to supply a second cleaning medium to the substrate supported by the support unit.
Public/Granted literature
- US20180182628A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Public/Granted day:2018-06-28
Information query
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