Invention Grant
- Patent Title: Light-emitting device package
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Application No.: US15319486Application Date: 2015-06-08
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Publication No.: US10396247B2Publication Date: 2019-08-27
- Inventor: Byung Mok Kim , Hiroshi Kodaira , Baek Jun Kim , Ha Na Kim , Jung Woo Lee , Sang Ung Hwang
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2014-0074102 20140618
- International Application: PCT/KR2015/005690 WO 20150608
- International Announcement: WO2015/194779 WO 20151223
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/60 ; H01L33/38 ; H05K1/02 ; F21V7/05 ; H01L51/00

Abstract:
A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.
Public/Granted literature
- US20170324003A1 LIGHT-EMITTING DEVICE PACKAGE Public/Granted day:2017-11-09
Information query
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