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公开(公告)号：US09831395B2
公开(公告)日：2017-11-28
申请号：US14978741
申请日：2015-12-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun Kim , Hiroshi Kodaira , Ki Man Kang , Ha Na Kim , Hyun Don Song , Jung Woo Lee , Jung Hun Oh
CPC classification number: H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/16315 , H01L2933/0058 , H01L2924/00014
Abstract: A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.
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公开(公告)号：US10396247B2
公开(公告)日：2019-08-27
申请号：US15319486
申请日：2015-06-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Baek Jun Kim , Ha Na Kim , Jung Woo Lee , Sang Ung Hwang
Abstract: A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.
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3.发明授权公开(公告)号：US10714660B2
公开(公告)日：2020-07-14
申请号：US15319318
申请日：2015-05-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Ha Na Kim , Hiroshi Kodaira , Baek Jun Kim , Jung Woo Lee , Sang Ung Hwang
Abstract: A light-emitting device package according to an embodiment includes a package body including a cavity and a recessed portion formed around the cavity, the recessed portion having at least one concave portion; at least one light-emitting device mounted in the cavity; a light-transmitting member disposed to cover a top of the cavity and configured to transmit light emitted from the at least one light-emitting device; and a bonding member accommodated in the at least one concave portion so as to allow the light-transmitting member and the package body to be bonded to each other in the recessed portion.
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Patent Agency Ranking
公开(公告)号：US11257998B2
公开(公告)日：2022-02-22
申请号：US16496304
申请日：2018-03-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Keon Hwa Lee , Do Yub Kim , Myung Sub Kim , Baek Jun Kim
Abstract: A semiconductor element package includes: a semiconductor element arranged above a first substrate; first and second electrodes arranged above the first substrate and electrically connected to the semiconductor element; a housing which is arranged above the first substrate and arranged around the semiconductor element, and which has a stepped portion in the upper area thereof; a diffusion part arranged on the stepped portion of the housing and arranged above the semiconductor element; and a plurality of via holes penetrating the first substrate and the housing.
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公开(公告)号：US09887324B2
公开(公告)日：2018-02-06
申请号：US14484637
申请日：2014-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun Kim , Hiroshi Kodaira , Byung Mok Kim , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/486 , H01L33/36 , H01L33/44 , H01L33/48 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48145 , H01L2224/49107 , H01L2224/73265 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.
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公开(公告)号：US20210104648A1
公开(公告)日：2021-04-08
申请号：US16496304
申请日：2018-03-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Keon Hwa Lee , Do Yub Kim , Myung Sub Kim , Baek Jun Kim
Abstract: A semiconductor element package includes: a semiconductor element arranged above a first substrate; first and second electrodes arranged above the first substrate and electrically connected to the semiconductor element; a housing which is arranged above the first substrate and arranged around the semiconductor element, and which has a stepped portion in the upper area thereof; a diffusion part arranged on the stepped portion of the housing and arranged above the semiconductor element; and a plurality of via holes penetrating the first substrate and the housing.
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公开(公告)号：US10910790B2
公开(公告)日：2021-02-02
申请号：US16465461
申请日：2017-12-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun Kim , Ho Jae Kang , Hui Seong Kang , Keon Hwa Lee , Yong Gyeong Lee
Abstract: Embodiments pertain to a semiconductor device package, a method of manufacturing the semiconductor device package, and an autofocusing apparatus including the semiconductor device package. The semiconductor device package according to an embodiment may include: a package body; a diffusion unit; and a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a support and under the diffusion unit. According to the embodiment, the package body may include the support, a first sidewall protruding to a first thickness from an edge region of an upper surface of the support and having a first upper surface of a first width, and a second sidewall protruding to a second thickness from the first upper surface of the first side wall and having a second upper surface of a second width, wherein the support, the first sidewall, and the second sidewall may be integrally formed with the same material. The diffusion unit may be disposed on the first upper surface of the first sidewall and may be disposed to be surrounded by the second sidewall.
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公开(公告)号：USD762183S1
公开(公告)日：2016-07-26
申请号：US29524935
申请日：2015-04-24
Applicant: LG INNOTEK CO., LTD.
Designer： Byung Mok Kim , Hae Jin Park , Baek Jun Kim , Ha Na Kim
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