Invention Grant
- Patent Title: High solids content dendrimer polymer composition
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Application No.: US14232555Application Date: 2012-08-22
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Publication No.: US10400132B2Publication Date: 2019-09-03
- Inventor: Shaofeng Wang , Swee How Seow , Zeling Dou , Thomas F. Choate , Xiaoqun Ye
- Applicant: Shaofeng Wang , Swee How Seow , Zeling Dou , Thomas F. Choate , Xiaoqun Ye
- Applicant Address: SG Singapore
- Assignee: NIPSEA TECHNOLOGIES PTE LTD
- Current Assignee: NIPSEA TECHNOLOGIES PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Hovey Williams LLP
- Priority: GB1114554.7 20110823
- International Application: PCT/SG2012/000296 WO 20120822
- International Announcement: WO2013/028133 WO 20130228
- Main IPC: C09D175/06
- IPC: C09D175/06 ; C09D133/08 ; C08G18/66 ; C08G18/79 ; C08G18/24 ; C08G18/32 ; C08G18/42 ; C08G83/00 ; C09D201/00 ; C08L75/06

Abstract:
The present invention relates to a polymer composition comprising: (i) one or more dendritic polymers; and (ii) a reactive diluent that is capable of being chemically coupled to the functional groups of the dendritic polymers, wherein when the dendritic polymer is coupled to the reactive diluent in the presence of a cross-linker, a polymerized solid is formed at high concentrations in a liquid medium. The present invention further relates to methods of preparing the polymer composition and its use in forming coatings.
Public/Granted literature
- US20140142237A1 HIGH SOLIDS CONTENT DENDRIMER POLYMER COMPOSITION Public/Granted day:2014-05-22
Information query
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