A radio frequency circuit includes, a multilayer substrate having a grounded base metal and a plurality of insulating layers and wiring layers formed over the grounded base metal and having a recess surrounded by the plurality of insulating layers and wiring layers over the grounded base metal, an upper substrate having a through-hole penetrating the upper substrate, a first semiconductor chip mounted on the upper surface of the upper substrate and electrically coupled to a metal film formed on the lower surface of the upper substrate, a metal pillar formed on the upper surface of the grounded base metal in the recess, and a solder buried in the through-hole and bonded to the metal film and the upper surface of the metal pillar. The metal film is bonded to a ground wiring layer electrically coupled to the grounded base metal among the plurality of wiring layers.