- Patent Title: Light emitting element package and method of manufacturing the same
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Application No.: US15391283Application Date: 2016-12-27
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Publication No.: US10411175B2Publication Date: 2019-09-10
- Inventor: Il Woo Park , Cheol Jun Yoo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0026068 20120314; KR10-2013-0000946 20130104
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L33/38 ; H01L33/46 ; H01L33/50 ; H01L33/56 ; H01L33/60 ; H01L33/62
Abstract:
There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.
Public/Granted literature
- US20170110636A1 LIGHT EMITTING ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-04-20
Information query
IPC分类:
