Invention Grant
- Patent Title: Integrated component interconnect
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Application No.: US15038582Application Date: 2013-12-23
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Publication No.: US10423552B2Publication Date: 2019-09-24
- Inventor: David J. Harriman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- International Application: PCT/US2013/077512 WO 20131223
- International Announcement: WO2015/099660 WO 20150702
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F15/177 ; G06F13/40 ; G06F13/42
Abstract:
A data structure is accessed that defines configuration parameters of one or more integrated blocks in an integrated circuit device. One or more of the integrated blocks is configured based on corresponding configuration parameters defined in the data structure. The configuration parameters are set prior to runtime and are to be persistently stored in the data structure.
Public/Granted literature
- US20160299860A1 INTEGRATED COMPONENT INTERCONNECT Public/Granted day:2016-10-13
Information query
