- 专利标题: Separation device and separation method
-
申请号: US14745847申请日: 2015-06-22
-
公开(公告)号: US10427327B2公开(公告)日: 2019-10-01
- 发明人: Hiroshi Ito , Shinobu Hatanaka , Junji Yoshinaga , Hiroyuki Ando
- 申请人: DAIKI CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: DAIKI CO., LTD.
- 当前专利权人: DAIKI CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 主分类号: B29B17/02
- IPC分类号: B29B17/02 ; B02C21/00 ; B02C23/10 ; B02C23/14 ; B02C23/16 ; B07B1/24 ; B09B3/00 ; B09B5/00 ; B29B17/04 ; B03B9/06 ; B29L31/48
摘要:
A separation device includes a first shredding unit, a first separation unit, a second shredding unit, and a second separation unit. The first shredding unit shreds a processing target containing a first material and a second material. The first separation unit rotates a first tubular portion in a state in which the processing target shredded by the first shredding unit is accommodated therein, thereby separating the second material passing through first holes from the processing target. The second shredding unit shreds the processing target from which the second material passing through the first holes is separated by the first separation unit. The second separation unit rotates a second tubular portion in a state in which the processing target shredded by the second shredding unit is accommodated therein, thereby separating the second material passing through second holes from the processing target.
公开/授权文献
- US20150283732A1 SEPARATION DEVICE AND SEPARATION METHOD 公开/授权日:2015-10-08
信息查询