Invention Grant
- Patent Title: Manufacturing method for semiconductor structure
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Application No.: US16137914Application Date: 2018-09-21
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Publication No.: US10427935B2Publication Date: 2019-10-01
- Inventor: Te-Huang Chiu , Weng-Yi Chen , Kuan-Yu Wang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: TW106102636A 20170124
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A manufacturing method for a semiconductor structure is disclosed. The semiconductor structure includes a MEMS region. The MEMS region includes a sensing membrane and a metal ring. The metal ring defines a cavity under the sensing membrane.
Public/Granted literature
- US20190016591A1 MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE Public/Granted day:2019-01-17
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