Invention Grant
- Patent Title: Semiconductor device including gate having dents and spacer protrusions extending therein
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Application No.: US15404673Application Date: 2017-01-12
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Publication No.: US10431685B2Publication Date: 2019-10-01
- Inventor: Jae-hoon Lee , Gi-gwan Park , Tae-young Kim , Yi-young Na , Dae-hee Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0008036 20160122
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L21/8234

Abstract:
A semiconductor device includes a substrate including a fin-shaped active region that protrudes from the substrate; a gate insulating film covering a top surface and both side walls of the fin-shaped active region; a gate electrode on the top surface and the both side walls of the fin-shaped active region and covering the gate insulating film; one pair of insulating spacers on both side walls of the gate electrode; and a source region and a drain region on the substrate and respectively located on sides of the gate electrode. The source region and the drain region form a source/drain pair. The one pair of insulating spacers include protrusions that protrude from upper portions of the one pair of insulating spacers toward the gate electrode.
Public/Granted literature
- US20170213905A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-07-27
Information query
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