Invention Grant
- Patent Title: Technologies for scalable local addressing in high-performance network fabrics
-
Application No.: US15531153Application Date: 2014-12-27
-
Publication No.: US10432582B2Publication Date: 2019-10-01
- Inventor: Todd M. Rimmer , Albert S. Cheng
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Barnes & Thornburg LLP
- International Application: PCT/US2014/072460 WO 20141227
- International Announcement: WO2016/105445 WO 20160630
- Main IPC: H04L29/12
- IPC: H04L29/12 ; H04L12/64 ; H04L12/761 ; H04L12/931 ; H04L29/06

Abstract:
Technologies for scalable local addressing include one or more managed network devices coupled to one or more computing nodes via high-speed fabric links. A computing node may transmit a data packet including a destination local identifier (DLID) that identifies the destination computing node. The DLID may be 32, 24, 20, or 16 bits wide. The managed network device may determine whether the DLID is within a configurable multicast address space and, if so, forward the data packet to a multicast group. The managed network device may also determine whether the DLID is within a configurable collective address space and, if so, perform a collective acceleration operation. The number of top-most bits set in a multicast mask and the number of additional top-most bits set in a collective mask may be configured. Multicast LIDs may be converted between different bit lengths. Other embodiments are described and claimed.
Public/Granted literature
- US20170339103A1 TECHNOLOGIES FOR SCALABLE LOCAL ADDRESSING IN HIGH-PERFORMANCE NETWORK FABRICS Public/Granted day:2017-11-23
Information query