Invention Grant
- Patent Title: Polishing compositions and methods of manufacturing semiconductor devices using the same
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Application No.: US15214847Application Date: 2016-07-20
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Publication No.: US10435587B2Publication Date: 2019-10-08
- Inventor: Seung-Ho Park , Ki-Hwa Jung , Sang-Kyun Kim , Jun-Ha Hwang , Chang-Gil Kwon , Seung-Yeop Baek , Jae-Woo Lee , Ji-Sung Lee , Jae-Kwang Choi , Jin-Myung Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do KR Anseong-si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.,K.C. Tech Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,K.C. Tech Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do KR Anseong-si, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0102312 20150720
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/76 ; H01L21/82 ; C09G1/02 ; H01L21/762 ; H01L29/06 ; H01L21/3105 ; H01L29/78 ; H01L21/8238 ; H01L29/66
Abstract:
A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.
Public/Granted literature
- US20170029664A1 POLISHING COMPOSITIONS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME Public/Granted day:2017-02-02
Information query
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