公开(公告)号：US10435587B2

公开(公告)日：2019-10-08

申请号：US15214847

申请日：2016-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Ho Park ,  Ki-Hwa Jung ,  Sang-Kyun Kim ,  Jun-Ha Hwang ,  Chang-Gil Kwon ,  Seung-Yeop Baek ,  Jae-Woo Lee ,  Ji-Sung Lee ,  Jae-Kwang Choi ,  Jin-Myung Hwang

IPC: H01L21/31 ,  H01L21/76 ,  H01L21/82 ,  C09G1/02 ,  H01L21/762 ,  H01L29/06 ,  H01L21/3105 ,  H01L29/78 ,  H01L21/8238 ,  H01L29/66

Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.