- Patent Title: Integration of vertical-transport transistors and electrical fuses
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Application No.: US15338925Application Date: 2016-10-31
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Publication No.: US10439031B2Publication Date: 2019-10-08
- Inventor: Ruilong Xie , Kangguo Cheng , Tenko Yamashita , Chun-chen Yeh
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L27/112 ; H01L29/417 ; H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L21/762

Abstract:
Structures for a vertical-transport field-effect transistor and an electrical fuse integrated into an integrated circuit, and methods of fabricating a vertical-transport field-effect transistor and an electrical fuse integrated into an integrated circuit. A doped semiconductor layer that includes a first region with a first electrode of the vertical electrical fuse and a second region with a first source/drain region of the vertical-transport field effect transistor. A semiconductor fin is formed on the first region of the doped semiconductor layer, and a fuse link is formed on the second region of the doped semiconductor layer. A second source/drain region is formed that is coupled with the fin. A gate structure is arranged vertically between the first source/drain region and the second source/drain region. A second electrode of the vertical fuse is formed such that the fuse link is arranged vertically between the first electrode and the second electrode.
Public/Granted literature
- US20180122913A1 INTEGRATION OF VERTICAL-TRANSPORT TRANSISTORS AND ELECTRICAL FUSES Public/Granted day:2018-05-03
Information query
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