Invention Grant
- Patent Title: Chip with integrated phosphor
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Application No.: US14053404Application Date: 2013-10-14
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Publication No.: US10439107B2Publication Date: 2019-10-08
- Inventor: Sten Heikman , James Ibbetson , Zhimin Jamie Yao , Fan Zhang , Matthew Donofrio , Christopher P. Hussell , John A. Edmond
- Applicant: CREE, INC.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Ferguson Case Orr Paterson, LLP
- Main IPC: H01L33/44
- IPC: H01L33/44 ; H01L33/50 ; H01L33/00 ; H01L33/20 ; H01L33/48

Abstract:
This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.
Public/Granted literature
- US20140217443A1 CHIP WITH INTEGRATED PHOSPHOR Public/Granted day:2014-08-07
Information query
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