SOLID STATE LIGHTING DEVICE PROVIDING SPECTRAL POWER DISTRIBUTION WITH ENHANCED PERCEIVED BRIGHTNESS

    公开(公告)号:US20190341531A1

    公开(公告)日:2019-11-07

    申请号:US15972152

    申请日:2018-05-05

    Applicant: Cree, Inc.

    Abstract: A solid state lighting device includes at least one electrically activated solid state light emitter configured to stimulate emissions of first through third lumiphoric materials having peak wavelengths in ranges of from 485 nm to 530 nm, from 575 nm to 595 nm, and from 605 nm to 640 nm, respectively (or subranges thereof defined herein), with the third peak having a full width half maximum value of less than 60 nm. The resulting device generates aggregated emissions having a suitably high color rendering index (e.g., CRI Ra) value (e.g., at least 70), and also having a spectral power distribution with a Melanopic/Photopic ratio within a specified target range as a function of correlated color temperature, thereby providing increased perceived brightness.

    Molded chip fabrication method and apparatus

    公开(公告)号:US09105817B2

    公开(公告)日:2015-08-11

    申请号:US14209652

    申请日:2014-03-13

    Applicant: CREE, INC.

    Abstract: A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

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