Invention Grant
- Patent Title: Processing apparatus and processing method of stack
-
Application No.: US15610890Application Date: 2017-06-01
-
Publication No.: US10442172B2Publication Date: 2019-10-15
- Inventor: Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-179217 20130830; JP2013-179220 20130830; JP2014-029422 20140219; JP2014-029423 20140219
- Main IPC: B32B43/00
- IPC: B32B43/00 ; G02B6/00 ; H01L21/67 ; B26D1/04 ; H01L51/56 ; B32B38/10 ; B26D1/00 ; H01L27/12 ; H01L27/32

Abstract:
A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
Public/Granted literature
- US20170334187A1 PROCESSING APPARATUS AND PROCESSING METHOD OF STACK Public/Granted day:2017-11-23
Information query