Invention Grant
- Patent Title: Electronic component and board having electronic component mounted thereon
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Application No.: US15179513Application Date: 2016-06-10
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Publication No.: US10448502B2Publication Date: 2019-10-15
- Inventor: Ho Yoon Kim , Kyoung Jin Jun , Min Kyoung Cheon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0142210 20151012
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/34 ; H05K1/14 ; H05K3/30 ; H05K1/03
Abstract:
An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus.
Public/Granted literature
- US20170105283A1 ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON Public/Granted day:2017-04-13
Information query
