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公开(公告)号：US11206737B2
公开(公告)日：2021-12-21
申请号：US16856444
申请日：2020-04-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su Byun , Ho Yoon Kim , Kyung Hwa Yu , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
IPC: H05K1/18 , H01G4/30 , H01G4/232 , H01G4/002 , H01G4/40 , H01G2/06 , H05K3/30 , H01G4/12 , H05K1/11 , H05K3/34
Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.
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公开(公告)号：US11166375B2
公开(公告)日：2021-11-02
申请号：US16691787
申请日：2019-11-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su Byun , Ho Yoon Kim , Kyung Hwa Yu , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
IPC: H05K1/18 , H01G4/30 , H01G4/232 , H01G4/002 , H01G4/40 , H01G2/06 , H05K3/30 , H01G4/12 , H05K1/11 , H05K3/34
Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.
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公开(公告)号：US10910163B2
公开(公告)日：2021-02-02
申请号：US16365088
申请日：2019-03-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Heon Jeong , Kyung Hwa Yu , Man Su Byun , Min Kyoung Cheon , Soo Hwan Son , Ho Yoon Kim
Abstract: A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.
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公开(公告)号：US20150102888A1
公开(公告)日：2015-04-16
申请号：US14281097
申请日：2014-05-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myeong Gi KIM , Il Jin Park , Ho Yoon Kim , Jin Woo Hahn , Min Kyoung Cheon
IPC: H01F27/255 , H01F27/28
CPC classification number: H01F17/0013
Abstract: A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.
Abstract translation: 多层电子部件可以包括：堆叠多个磁性层的磁性体; 以及形成在磁体上的导体图案。 磁体可以包括：金属磁性颗粒; 形成在所述金属磁性体的表面上的氧化膜，作为通过使所述金属磁性体的至少一种成分氧化而得到的第一氧化物; 以及填充部分，其形成在金属磁性颗粒之间的空间中，作为通过氧化金属磁性颗粒的至少一种成分而获得的第二氧化物。 第一氧化物和第二氧化物中的至少一个设置在相邻的金属磁性颗粒之间，形成在金属磁性颗粒的表面上的氧化膜形成具有在相邻的金属磁性颗粒的表面上形成的氧化膜的颈部 。
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公开(公告)号：US10937581B2
公开(公告)日：2021-03-02
申请号：US16266617
申请日：2019-02-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Yu Jin Choi , Soo Hwan Son , Min Kyoung Cheon
Abstract: A hybrid inductor includes an inductor body having a core part in which a coil part is disposed, and first and second cover parts having the core part interposed therebetween. The core part includes magnetic metal layers, and the first and second cover parts include ferrite layers.
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Patent Agency Ranking
公开(公告)号：US10542626B2
公开(公告)日：2020-01-21
申请号：US16001510
申请日：2018-06-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Kyung Hwa Yu , Man Su Byun , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05≤A1/A1≤0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.
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公开(公告)号：US10321571B2
公开(公告)日：2019-06-11
申请号：US15295502
申请日：2016-10-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yu Jin Choi , Soo Hwan Son , Min Kyoung Cheon
IPC: H05K1/18 , H01G4/008 , H01G4/228 , H01G4/38 , H01G4/224 , H01G4/30 , H01G9/042 , H01G9/08 , H01G15/00 , H05K1/11 , H01G4/40 , H01G9/012 , H01G9/15 , H01G2/06
Abstract: A composite electronic component includes a multilayer capacitor including external electrodes, a tantalum capacitor disposed adjacently to the multilayer capacitor, first electrode parts connected to the external electrodes, a second electrode part connected to a second body, and an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor and formed such that portions of the first and second electrode parts are exposed.
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公开(公告)号：US20200006003A1
公开(公告)日：2020-01-02
申请号：US16365088
申请日：2019-03-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Heon Jeong , Kyung Hwa Yu , Man Su Byun , Min Kyoung Cheon , Soo Hwan Son , Ho Yoon Kim
Abstract: A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.
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公开(公告)号：US10448502B2
公开(公告)日：2019-10-15
申请号：US15179513
申请日：2016-06-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Kyoung Jin Jun , Min Kyoung Cheon
Abstract: An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus.
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公开(公告)号：US10403441B2
公开(公告)日：2019-09-03
申请号：US15974285
申请日：2018-05-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Kyung Hwa Yu , Man Su Byun , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
IPC: H01G4/012 , H01G4/40 , H01G4/30 , H01G4/232 , H01G4/248 , H01G4/224 , H02H9/02 , H05K1/18 , H01G4/12
Abstract: A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.
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