Invention Grant
- Patent Title: Methods for high-throughput fluorescence imaging with sample heating capability
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Application No.: US15413045Application Date: 2017-01-23
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Publication No.: US10451551B2Publication Date: 2019-10-22
- Inventor: Bowei Zhang
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop Gage LLP
- Main IPC: C12Q1/6809
- IPC: C12Q1/6809 ; G01N21/64 ; G01N21/03 ; B01L3/00 ; B01L7/00 ; G01N21/17 ; G01J3/44

Abstract:
A method for high-throughput assay processing includes (a) modulating temperature of a plurality of samples disposed in a respective plurality of fluidic channels on an image sensor wafer, including a plurality of image sensors, by heating the image sensor wafer using a heating module thermally coupled with the image sensor wafer, to control reaction dynamics in the samples, and (b) capturing a plurality of fluorescence images of the samples, using the plurality of image sensors, to detect one or more components of the plurality of samples. A method for manufacturing a high-throughput fluorescence imaging system with sample heating capability includes (a) bonding a fluidic wafer, including a plurality of recesses, to an image sensor wafer including a plurality of image sensors, and (b) bonding a heating module, including a heater for generating heat, to the image sensor wafer to thermally couple the heater and the image sensor wafer.
Public/Granted literature
- US20170167978A1 METHODS FOR HIGH-THROUGHPUT FLUORESCENCE IMAGING WITH SAMPLE HEATING CAPABILITY Public/Granted day:2017-06-15
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