Invention Grant
- Patent Title: Thermal management structure with integrated heat sink
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Application No.: US15645321Application Date: 2017-07-10
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Publication No.: US10453769B2Publication Date: 2019-10-22
- Inventor: Yuri Bilenko , Michael Shur , Remigijus Gaska
- Applicant: Sensor Electronic Technology, Inc.
- Applicant Address: US SC Columbia
- Assignee: Sensor Electronic Technology, Inc.
- Current Assignee: Sensor Electronic Technology, Inc.
- Current Assignee Address: US SC Columbia
- Agency: LaBatt, LLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/288 ; H01L23/498 ; H01L23/367 ; H01L33/20 ; H01L33/38 ; H01L33/64
Abstract:
A thermal management structure for a device is provided. The thermal management structure includes electroplated metal, which connects multiple contact regions for a first contact of a first type located on a first side of the device. The electroplated metal can form a bridge structure over a contact region for a second contact of a second type without contacting the second contact. The thermal management structure also can include a layer of insulating material located on the contact region of the second type, below the bridge structure.
Public/Granted literature
- US20170317003A1 Thermal Management Structure with Integrated Heat Sink Public/Granted day:2017-11-02
Information query
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