Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and storage medium
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Application No.: US14886325Application Date: 2015-10-19
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Publication No.: US10460949B2Publication Date: 2019-10-29
- Inventor: Hiroyuki Takahashi , Kazunori Kazama , Noriyuki Iwabuchi , Satoshi Toda , Tetsuro Takahashi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014-213887 20141020; JP2015-036889 20150226; JP2015-182489 20150916
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; C23C16/455 ; C23C16/52 ; C23C16/44 ; H01L21/67 ; H01L21/311
Abstract:
There is provided a substrate processing apparatus of performing a predetermined substrate process on a plurality of target substrates under a vacuum atmosphere, including: a plurality of processing parts each configured to perform the substrate process on each of the plurality of target substrates; a gas supply mechanism configured to supply a processing gas to each of the plurality of processing parts; a single exhaust mechanism configured to exhaust the processing gas within the plurality of processing parts; and a control part configured to control the single exhaust mechanism to collectively exhaust the processing gas within the plurality of processing parts, and control the gas supply mechanism to separately supply the processing gas into each of the plurality of processing parts such that a difference between internal pressures of the plurality of processing parts is prevented.
Public/Granted literature
- US20160111304A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM Public/Granted day:2016-04-21
Information query
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