Invention Grant
- Patent Title: Manufacturing method of semiconductor device
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Application No.: US16360019Application Date: 2019-03-21
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Publication No.: US10460997B2Publication Date: 2019-10-29
- Inventor: En-Chiuan Liou , Yu-Cheng Tung , Chih-Wei Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hu
- Priority: TW105125890A 20160815
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L21/8234 ; H01L29/06 ; H01L27/12 ; H01L21/84 ; H01L27/088 ; H01L29/08 ; H01L21/82 ; H01L29/66

Abstract:
A semiconductor device includes a semiconductor substrate, an isolation structure, and a spacer. The semiconductor substrate includes at least one fin structure. The isolation structure is partly disposed in the fin structure and partly disposed above the fin structure. The fin structure includes a first fin and a second fin elongated in the same direction. A part of the isolation structure is disposed between the first fin and the second fin in the direction where the first fin and the second fin are elongated. The spacer is disposed on sidewalls of the isolation structure on the fin structure. The isolation structure in the present invention is partly disposed in the fin structure and partly disposed above the fin structure. The negative influence of a gate structure formed on the isolation structure and sinking into the isolation structure on the isolation performance of the isolation structure may be avoided accordingly.
Public/Granted literature
- US20190221482A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2019-07-18
Information query
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