Invention Grant
- Patent Title: Semiconductor devices
-
Application No.: US15864330Application Date: 2018-01-08
-
Publication No.: US10461195B2Publication Date: 2019-10-29
- Inventor: Taesoon Duyeon Kwon , JeongYun Lee , A-reum Ji , Kyungseok Min , GeumJung Seong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2017-0047542 20170412
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L21/02 ; H01L21/764 ; H01L29/66 ; B82Y10/00 ; H01L29/417 ; H01L29/775 ; H01L29/165

Abstract:
Disclosed is a semiconductor device. The semiconductor device includes a substrate, channel semiconductor patterns vertically stacked and spaced apart from each other on the substrate, a gate electrode running across the channel semiconductor patterns, source/drain regions at opposite sides of the gate electrode, the source/drain regions being connected to the channel semiconductor patterns, and air gaps between the substrate and bottom surfaces of the source/drain regions so that the bottom surfaces of the source/drain regions do not contact the substrate.
Public/Granted literature
- US20180301564A1 SEMICONDUCTOR DEVICES Public/Granted day:2018-10-18
Information query
IPC分类: