Semiconductor device, electronic device including the same and manufacturing methods thereof
    1.
    发明授权
    Semiconductor device, electronic device including the same and manufacturing methods thereof 有权
    半导体装置,包括该装置的电子装置及其制造方法

    公开(公告)号:US09312181B2

    公开(公告)日:2016-04-12

    申请号:US14531987

    申请日:2014-11-03

    Abstract: The disclosure provides semiconductor devices and methods of manufacturing the same. The method includes etching a substrate using a first mask pattern formed on the substrate to form a trench, forming a preliminary device isolation pattern filling the trench and including first and second regions having first thicknesses, forming a second mask pattern on the first region, etching an upper portion of the second region and a portion of the first mask pattern, which are exposed by the second mask pattern, to form a second region having a second thickness smaller than the first thickness, removing the first and second mask patterns, and etching upper portions of the first region and the second region having the second thickness to form a device isolation pattern defining preliminary fin-type active patterns. An electronic device including a semiconductor device and a manufacturing method thereof are also disclosed.

    Abstract translation: 本公开提供半导体器件及其制造方法。 该方法包括使用形成在衬底上的第一掩模图案来蚀刻衬底以形成沟槽,形成填充沟槽的初步器件隔离图案,并且包括具有第一厚度的第一和第二区域,在第一区域上形成第二掩模图案,蚀刻 第二区域的上部和第一掩模图案的一部分被第二掩模图案曝光,以形成具有小于第一厚度的第二厚度的第二区域,去除第一和第二掩模图案,以及蚀刻 所述第一区域的上部和所述第二区域具有第二厚度,以形成限定预备鳍型活性图案的器件隔离图案。 还公开了一种包括半导体器件及其制造方法的电子器件。

    Methods of fabricating semiconductor devices

    公开(公告)号:US10186457B2

    公开(公告)日:2019-01-22

    申请号:US15794107

    申请日:2017-10-26

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

    Methods of fabricating semiconductor devices

    公开(公告)号:US10522401B2

    公开(公告)日:2019-12-31

    申请号:US16237948

    申请日:2019-01-02

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

    Semiconductor device
    8.
    发明授权

    公开(公告)号:US10026809B1

    公开(公告)日:2018-07-17

    申请号:US15662248

    申请日:2017-07-27

    Abstract: Active patterns protrude from a substrate. The active patterns include a first active pattern, a second active pattern spaced apart from the first active pattern at a first distance, and a third active pattern spaced apart from the second active pattern at a second distance greater than the first distance. A gate spacer is disposed on sidewalls of a gate electrode running across the active patterns. Source/drain regions include a first to a third source/drain regions disposed on a region of one of the active patterns. The region of one of the active patterns is disposed adjacent to a side of the gate electrode. First and second protective insulation patterns are disposed on the substrate between the first and second active patterns below the first and second source/drain regions and between the second and third active patterns below the second and third source/drain regions, respectively.

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