A piezoelectric contact microphone with a mechanical vibration conduction interface provides an improved mobile electronic device microphone. In an embodiment, the mechanical vibration conduction interface is placed on a bone structure and conducts vibration from the bone structure to the piezoelectric contact microphone. Because of the direct contact, this use of piezoelectric contact microphone reduces or eliminates interferences effects due to wind and other airflow over the microphone. The mechanical vibration conduction interface materials and structure are selected to provide effective transmission of vibration from the bone structure to the piezoelectric element within the piezoelectric contact microphone. This piezoelectric contact microphone enables mobile electronic devices to provide improved voice communication, voice transcription, and voice command recognition in the presence of wind noise and other noise.