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公开(公告)号：US20170361390A1
公开(公告)日：2017-12-21
申请号：US15676679
申请日：2017-08-14
Applicant: Intel Corporation
Inventor： Ting Zhong , Rajashree Raji Baskaran , Aleksandar Aleksov
IPC: B23K1/20 , B23K35/30 , B23K35/26 , B23K1/00 , B23K3/08 , B23K3/06 , B23K35/02 , B23K35/24 , B23K101/42
CPC classification number: B23K1/20 , B23K1/0016 , B23K1/206 , B23K3/0623 , B23K3/08 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/26 , B23K35/302 , B23K35/3033 , B23K2101/42
Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
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Patent Agency Ranking
公开(公告)号：US11366431B2
公开(公告)日：2022-06-21
申请号：US15280060
申请日：2016-09-29
Applicant: Intel Corporation
Inventor： Aycan Erentok , Rajashree Raji Baskaran
Abstract: A multi-function input interface for an electronic device. The multi-function input interface including a conductive portion to transceive a signal through the input interface. The input interface includes a positional element to detect a user input to the input interface.
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公开(公告)号：US10462578B2
公开(公告)日：2019-10-29
申请号：US15589203
申请日：2017-05-08
Applicant: Intel Corporation
Inventor： Kevin R. Hoskins , Arun P. Jose , David Harkness , Georgios C. Dogiamis , Rajashree Raji Baskaran
Abstract: A piezoelectric contact microphone with a mechanical vibration conduction interface provides an improved mobile electronic device microphone. In an embodiment, the mechanical vibration conduction interface is placed on a bone structure and conducts vibration from the bone structure to the piezoelectric contact microphone. Because of the direct contact, this use of piezoelectric contact microphone reduces or eliminates interferences effects due to wind and other airflow over the microphone. The mechanical vibration conduction interface materials and structure are selected to provide effective transmission of vibration from the bone structure to the piezoelectric element within the piezoelectric contact microphone. This piezoelectric contact microphone enables mobile electronic devices to provide improved voice communication, voice transcription, and voice command recognition in the presence of wind noise and other noise.
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公开(公告)号：US20180324530A1
公开(公告)日：2018-11-08
申请号：US15589203
申请日：2017-05-08
Applicant: Intel Corporation
Inventor： Kevin R. Hoskins , Arun P. Jose , David Harkness , Georgios C. Dogiamis , Rajashree Raji Baskaran
CPC classification number: H04R17/02 , H04R1/265 , H04R1/46 , H04R2410/07 , H04R2499/11
Abstract: A piezoelectric contact microphone with a mechanical vibration conduction interface provides an improved mobile electronic device microphone. In an embodiment, the mechanical vibration conduction interface is placed on a bone structure and conducts vibration from the bone structure to the piezoelectric contact microphone. Because of the direct contact, this use of piezoelectric contact microphone reduces or eliminates interferences effects due to wind and other airflow over the microphone. The mechanical vibration conduction interface materials and structure are selected to provide effective transmission of vibration from the bone structure to the piezoelectric element within the piezoelectric contact microphone. This piezoelectric contact microphone enables mobile electronic devices to provide improved voice communication, voice transcription, and voice command recognition in the presence of wind noise and other noise.
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公开(公告)号：US10099307B2
公开(公告)日：2018-10-16
申请号：US15676679
申请日：2017-08-14
Applicant: Intel Corporation
Inventor： Ting Zhong , Rajashree Raji Baskaran , Aleksandar Aleksov
IPC: B23K1/00 , B23K1/20 , B23K3/06 , B23K3/08 , B23K35/02 , B23K35/24 , B23K35/26 , B23K35/30 , B23K101/42
Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
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公开(公告)号：US09731369B2
公开(公告)日：2017-08-15
申请号：US13801803
申请日：2013-03-13
Applicant: Intel Corporation
Inventor： Ting Zhong , Rajashree Raji Baskaran , Aleksandar Aleks Aleksov
IPC: B23K35/00 , B23K35/22 , B23K1/20 , B23K35/02 , B23K1/00 , B23K3/06 , B23K3/08 , B23K35/24 , B23K35/26 , B23K35/30 , B23K101/42
CPC classification number: B23K1/20 , B23K1/0016 , B23K1/206 , B23K3/0623 , B23K3/08 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/26 , B23K35/302 , B23K35/3033 , B23K2101/42
Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
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