- 专利标题： Wiring board manufacturing method and wiring board manufacturing device
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申请号： US15524128申请日： 2014-11-14
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公开(公告)号： US10462909B2公开(公告)日： 2019-10-29
- 发明人: Kenji Tsukada , Masatoshi Fujita , Yoshitaka Hashimoto , Akihiro Kawajiri , Masato Suzuki
- 申请人： FUJI CORPORATION
- 申请人地址： JP Chiryu-shi
- 专利权人： FUJI CORPORATION
- 当前专利权人： FUJI CORPORATION
- 当前专利权人地址： JP Chiryu-shi
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 国际申请： PCT/JP2014/080244 WO 20141114
- 国际公布： WO2016/075823 WO 20160519
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; H05K3/12 ; B33Y50/02 ; B29C64/124 ; B29C64/393 ; B41M3/00 ; B41M7/00 ; B29C64/112 ; B29C64/336 ; B33Y10/00 ; B33Y30/00 ; B33Y80/00 ; B29L31/34 ; H05K1/09
摘要：
A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.
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