公开(公告)号：US10212823B2

公开(公告)日：2019-02-19

申请号：US15523733

申请日：2014-11-07

Applicant: FUJI CORPORATION

Inventor： Yoshitaka Hashimoto ,  Masatoshi Fujita ,  Kenji Tsukada ,  Akihiro Kawajiri ,  Masato Suzuki

IPC: H05K3/12 ,  C23C14/58

Abstract: To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

公开(公告)号：US11849545B2

公开(公告)日：2023-12-19

申请号：US17274984

申请日：2018-10-16

Applicant: FUJI CORPORATION

Inventor： Kenji Tsukada ,  Ryojiro Tominaga

IPC: H05K3/12 ,  H05K3/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K1/09 ,  H05K3/30

CPC classification number: H05K3/1241 ,  H05K3/18 ,  H05K3/28 ,  H05K3/321 ,  H05K3/4007 ,  H05K1/095 ,  H05K3/1283 ,  H05K3/305 ,  H05K3/323 ,  H05K2203/1461

Abstract: A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

公开(公告)号：US11570900B2

公开(公告)日：2023-01-31

申请号：US17285162

申请日：2018-11-05

Applicant: FUJI CORPORATION

Inventor： Kenji Tsukada

IPC: H05K3/14 ,  H05K3/02 ,  H05K1/09

Abstract: A circuit forming method, comprising: a coating step of applying a metal-containing liquid and a metal paste in an overlapping manner on a base, the metal-containing liquid containing fine metal particles and the metal paste containing a resin binder and metal particles larger than the fine metal particles in the metal-containing liquid; and a heating step of making the metal-containing liquid and the metal paste coated in the coating step conductive by heating the metal-containing liquid and the metal paste.

公开(公告)号：US11470724B2

公开(公告)日：2022-10-11

申请号：US16688579

申请日：2019-11-19

Applicant: FUJI CORPORATION

Inventor： Masato Suzuki ,  Akihiro Kawajiri ,  Masatoshi Fujita ,  Kenji Tsukada ,  Yoshitaka Hashimoto

IPC: H05K3/00 ,  B33Y30/00 ,  B33Y10/00 ,  B22F3/105 ,  B29C67/00 ,  H05K3/12 ,  H05K1/09 ,  H05K3/46 ,  B33Y80/00 ,  B23P21/00 ,  H05K3/10

Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

公开(公告)号：US12048102B2

公开(公告)日：2024-07-23

申请号：US17630860

申请日：2019-07-30

Applicant: FUJI CORPORATION

Inventor： Ryojiro Tominaga ,  Kenji Tsukada ,  Ryo Sakakibara ,  Tasuku Takeuchi

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/40

CPC classification number: H05K3/10 ,  H05K3/40 ,  H05K2203/0776

Abstract: To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.

公开(公告)号：US10933589B2

公开(公告)日：2021-03-02

申请号：US16468930

申请日：2016-12-13

Applicant: FUJI CORPORATION

Inventor： Yoshitaka Hashimoto ,  Masatoshi Fujita ,  Kenji Tsukada ,  Akihiro Kawajiri ,  Masato Suzuki ,  Katsuaki Makihara

IPC: B29C64/393 ,  B33Y50/00 ,  B29C64/209 ,  B29C67/00 ,  G06F30/00 ,  B32B37/00

Abstract: To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.

公开(公告)号：US11439025B2

公开(公告)日：2022-09-06

申请号：US16301076

申请日：2016-06-08

Applicant: FUJI CORPORATION

Inventor： Yoshitaka Hashimoto ,  Masatoshi Fujita ,  Kenji Tsukada ,  Akihiro Kawajiri ,  Masato Suzuki ,  Katsuaki Makihara

IPC: H05K3/28 ,  H05K3/12 ,  H05K3/30 ,  H05K3/32 ,  H05K1/18 ,  H05K3/00

Abstract: In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.

公开(公告)号：US11006529B2

公开(公告)日：2021-05-11

申请号：US16307082

申请日：2016-06-28

Applicant: FUJI CORPORATION

Inventor： Kenji Tsukada ,  Masatoshi Fujita ,  Yoshitaka Hashimoto ,  Tasuku Takeuchi ,  Akihiro Kawajiri ,  Masato Suzuki ,  Katsuaki Makihara

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/46

Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.

公开(公告)号：US10667403B2

公开(公告)日：2020-05-26

申请号：US15512101

申请日：2014-09-19

Applicant: FUJI CORPORATION

Inventor： Masato Suzuki ,  Akihiro Kawajiri ,  Masatoshi Fujita ,  Kenji Tsukada ,  Yoshitaka Hashimoto

IPC: H05K3/00 ,  B33Y30/00 ,  B33Y10/00 ,  B22F3/105 ,  B29C67/00 ,  H05K3/12 ,  H05K1/09 ,  H05K3/46 ,  B33Y80/00 ,  B23P21/00 ,  H05K3/10

Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

公开(公告)号：US10462909B2

公开(公告)日：2019-10-29

申请号：US15524128

申请日：2014-11-14

Applicant: FUJI CORPORATION

Inventor： Kenji Tsukada ,  Masatoshi Fujita ,  Yoshitaka Hashimoto ,  Akihiro Kawajiri ,  Masato Suzuki

IPC: H05K3/00 ,  H05K3/12 ,  B33Y50/02 ,  B29C64/124 ,  B29C64/393 ,  B41M3/00 ,  B41M7/00 ,  B29C64/112 ,  B29C64/336 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B29L31/34 ,  H05K1/09

Abstract: A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.