Invention Grant
- Patent Title: Circuit board and method for manufacturing the same
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Application No.: US15880561Application Date: 2018-01-26
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Publication No.: US10468570B2Publication Date: 2019-11-05
- Inventor: Po-Hsuan Liao , Zong-Hua Li
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: TW106143403A 20171211
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/498 ; H01L21/48 ; H01L23/13 ; H01L33/58 ; H01L33/52

Abstract:
A circuit board includes a base plate, a first circuit layer, a first dielectric layer, and a light emitting element. The first circuit layer is disposed on the base plate. The first dielectric layer is disposed on the base plate and has plural openings. The first circuit layer is embedded in the first dielectric layer and exposes the openings. A Young's modulus of the first dielectric layer is greater than a Young's modulus of the base plate. The light emitting element is electrically connected to the first circuit layer through the openings.
Public/Granted literature
- US20190181315A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-06-13
Information query
IPC分类: