Invention Grant
- Patent Title: Method for manufacturing conductive pattern and conductive pattern formed substrate
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Application No.: US14786812Application Date: 2014-04-17
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Publication No.: US10470301B2Publication Date: 2019-11-05
- Inventor: Hiroshi Uchida , Kenji Shinozaki , Eri Okazaki , Hideki Ohata , Yasunao Miyamura
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-093882 20130426
- International Application: PCT/JP2014/060928 WO 20140417
- International Announcement: WO2014/175163 WO 20141030
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/12 ; H05K1/02 ; H01L51/00 ; G06F3/041 ; H05K3/10

Abstract:
Provided are a conductive pattern manufacturing method and a conductive pattern formed substrate, capable of easily achieving a narrow pitch. A metal nanowire layer 12 is formed on the entirety of a part of at least one of the main faces of a substrate 10, pulsed light is irradiated thereto through a mask 14 provided with a light transmission portion 14a formed in a predetermined pattern, and the metal nanowires in the metal nanowire layer 12 at the region having the above predetermined pattern were sintered, to thereby obtain conductivity at the predetermined patterned region. Accordingly, a substrate provided with a conductive pattern having any selected pattern can be produced by simple steps.
Public/Granted literature
- US20160073494A1 METHOD FOR MANUFACTURING CONDUCTIVE PATTERN AND CONDUCTIVE PATTERN FORMED SUBSTRATE Public/Granted day:2016-03-10
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