Thermosetting resin composition
    1.
    发明授权

    公开(公告)号:US10689493B2

    公开(公告)日:2020-06-23

    申请号:US15531587

    申请日:2015-12-11

    Abstract: A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

    CONDUCTIVE-PATTERN FORMING METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN BY PHOTO IRRADIATION OR MICROWAVE HEATING
    4.
    发明申请
    CONDUCTIVE-PATTERN FORMING METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN BY PHOTO IRRADIATION OR MICROWAVE HEATING 有权
    导电图案形成方法和组成通过照片辐照或微波加热形成导电图案

    公开(公告)号:US20150024120A1

    公开(公告)日:2015-01-22

    申请号:US14359958

    申请日:2012-11-26

    Inventor: Hiroshi Uchida

    Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

    Abstract translation: 提供一种导电图案形成方法和通过光照射或微波加热形成导电图案的组合物,其能够增加导电图案的导电性。 通过制备形成导电图案的组合物形成导电图案,所述组合物包括在其整个或部分表面上各自具有氧化铜薄膜的铜颗粒,氧化铜颗粒,还原剂如多元醇, 羧酸或聚亚烷基二醇,和粘合剂树脂; 使用该用于形成导电图案的组合物在基板上形成具有任何选定形状的印刷图案; 并对印刷图案进行光照射或微波加热以产生铜烧结体。

    CONDUCTIVE PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN VIA PHOTO IRRADIATION OR MICROWAVE HEATING
    5.
    发明申请
    CONDUCTIVE PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN VIA PHOTO IRRADIATION OR MICROWAVE HEATING 审中-公开
    导电图案形成方法和组合物通过照片辐射或微波加热形成导电图案

    公开(公告)号:US20140332734A1

    公开(公告)日:2014-11-13

    申请号:US14360361

    申请日:2012-11-26

    Inventor: Hiroshi Uchida

    Abstract: To provide a conductive pattern formation method capable of improving conductivity of a conductive pattern and a composition for forming a conductive pattern by means of photo irradiation or microwave heating. A composition for forming a conductive pattern that contains copper particles each having a copper oxide thin film formed on the entire or a part of a surface thereof, plate-like silver particles each being 10 to 200 nm thickness, and a binder resin is prepared. The composition for forming a conductive pattern is printed in a pattern having a desired shape on a substrate. Photo irradiation or microwave heating is applied to the printed pattern to thereby produce a copper/silver sintered body, to form a conductive film.

    Abstract translation: 提供能够通过光照射或微波加热提高导电图案的导电性和用于形成导电图案的组合物的导电图案形成方法。 制备含有形成在其整个或一部分表面上的氧化铜薄膜的铜颗粒的导电图案的组合物,厚度为10至200nm的板状银颗粒和粘合剂树脂。 用于形成导电图案的组合物以基板上具有所需形状的图案印刷。 对印刷图案施加照射照射或微波加热,从而制造铜/银烧结体,以形成导电膜。

    MICROWAVE HEATING APPARATUS
    7.
    发明申请
    MICROWAVE HEATING APPARATUS 审中-公开
    微波加热装置

    公开(公告)号:US20150223295A1

    公开(公告)日:2015-08-06

    申请号:US14430598

    申请日:2013-09-24

    CPC classification number: H05B6/707 H05B6/705 H05B6/78

    Abstract: Provided is a microwave heating apparatus capable of effectively preventing the generation of sparks when an object containing a conductor (including a metal precursor such as a metal oxide) or a semiconductor is subjected to microwave heating. A microwave heating apparatus supplies a microwave so that the direction of the electrical flux line of the microwave is identical with the direction substantially parallel with a surface of a plate-like substrate and having thereon a pattern containing a conductor, a metal oxide, or a semiconductor, the substrate being arranged in the waveguide. The microwave heating apparatus also controls a pulse width of the microwave so that pulsed microwaves are supplied to the surface having the pattern thereon.

    Abstract translation: 提供一种当包含导体(包括金属氧化物等金属前体)或半导体的物体进行微波加热时能够有效地防止产生火花的微波加热装置。 微波加热装置提供微波使得微波的电流线的方向与基板平行于板状基板的表面的方向相同,并且在其上具有包含导体,金属氧化物或金属氧化物的图案 半导体,衬底布置在波导中。 微波加热装置还控制微波的脉冲宽度,使得脉冲微波被提供给具有图案的表面。

    Microwave heating apparatus
    8.
    发明授权

    公开(公告)号:US10375773B2

    公开(公告)日:2019-08-06

    申请号:US14430598

    申请日:2013-09-24

    Abstract: Provided is a microwave heating apparatus capable of effectively preventing the generation of sparks when an object containing a conductor (including a metal precursor such as a metal oxide) or a semiconductor is subjected to microwave heating. A microwave heating apparatus supplies a microwave so that the direction of the electrical flux line of the microwave is identical with the direction substantially parallel with a surface of a plate-like substrate and having thereon a pattern containing a conductor, a metal oxide, or a semiconductor, the substrate being arranged in the waveguide. The microwave heating apparatus also controls a pulse width of the microwave so that pulsed microwaves are supplied to the surface having the pattern thereon.

    Thermosetting resin composition
    9.
    发明授权

    公开(公告)号:US10160856B2

    公开(公告)日:2018-12-25

    申请号:US15533549

    申请日:2015-12-11

    Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

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