Invention Grant
- Patent Title: Nozzle and substrate processing apparatus using same
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Application No.: US14933123Application Date: 2015-11-05
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Publication No.: US10472719B2Publication Date: 2019-11-12
- Inventor: Yu Wamura , Fumiaki Hayase , Masahiko Kaminishi , Kosuke Takahashi , Hiroko Sasaki , Yu Sasaki
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2014-234500 20141119
- Main IPC: C23C16/455
- IPC: C23C16/455 ; H01J37/32 ; B05B1/20

Abstract:
A nozzle for supplying a fluid includes a tubular part including a tubular passage thereinside and a fluid discharge surface having a plurality of fluid discharge holes formed therein along a lengthwise direction of the tubular passage. A partition plate is provided in the tubular passage and extends along the lengthwise direction so as to partition the tubular passage into a first area including the fluid discharge surface and a second area without the fluid discharge surface. The partition plate has distribution holes whose number is less than a number of the plurality of fluid discharge holes in the lengthwise direction. A fluid introduction passage is in communication with the second area.
Public/Granted literature
- US20160138158A1 NOZZLE AND SUBSTRATE PROCESSING APPARATUS USING SAME Public/Granted day:2016-05-19
Information query
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