Invention Grant
- Patent Title: Method of determining deformation location
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Application No.: US15736560Application Date: 2016-04-29
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Publication No.: US10473604B2Publication Date: 2019-11-12
- Inventor: James R. Salvador , Debejyo Chakraborty , Leonid C. Lev
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee Address: US MI Detroit
- Agency: Lorenz & Kopf, LLP
- International Application: PCT/US2016/030034 WO 20160429
- International Announcement: WO2017/003553 WO 20170105
- Main IPC: G01N27/04
- IPC: G01N27/04 ; G01D21/00 ; G01N27/12 ; G01R27/14 ; G01N27/26 ; C08L23/06 ; C08L23/12 ; C08L33/12

Abstract:
A number of variations may involve a method that may include providing a non-conductive layer. A conductive layer may be provided overlying the non-conductive layer with the conductive layer to form a sensor device. An opposition to electrical current through the conductive layer may be monitored. The location of a status of the non-conductive layer or of the conductive layer may be determined through a change in the opposition.
Public/Granted literature
- US20180172613A1 METHOD OF DETERMINING DEFORMATION LOCATION Public/Granted day:2018-06-21
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