- 专利标题: Method of determining deformation location
-
申请号: US15736560申请日: 2016-04-29
-
公开(公告)号: US10473604B2公开(公告)日: 2019-11-12
- 发明人: James R. Salvador , Debejyo Chakraborty , Leonid C. Lev
- 申请人: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- 申请人地址: US MI Detroit
- 专利权人: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- 当前专利权人: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- 当前专利权人地址: US MI Detroit
- 代理机构: Lorenz & Kopf, LLP
- 国际申请: PCT/US2016/030034 WO 20160429
- 国际公布: WO2017/003553 WO 20170105
- 主分类号: G01N27/04
- IPC分类号: G01N27/04 ; G01D21/00 ; G01N27/12 ; G01R27/14 ; G01N27/26 ; C08L23/06 ; C08L23/12 ; C08L33/12
摘要:
A number of variations may involve a method that may include providing a non-conductive layer. A conductive layer may be provided overlying the non-conductive layer with the conductive layer to form a sensor device. An opposition to electrical current through the conductive layer may be monitored. The location of a status of the non-conductive layer or of the conductive layer may be determined through a change in the opposition.
公开/授权文献
- US20180172613A1 METHOD OF DETERMINING DEFORMATION LOCATION 公开/授权日:2018-06-21
信息查询