Invention Grant
- Patent Title: Backside CMOS compatible BioFET with no plasma induced damage
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Application No.: US15649963Application Date: 2017-07-14
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Publication No.: US10473616B2Publication Date: 2019-11-12
- Inventor: Yi-Shao Liu , Chun-Ren Cheng , Ching-Ray Chen , Yi-Hsien Chang , Fei-Lung Lai , Chun-Wen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G01N27/414
- IPC: G01N27/414 ; H01L29/66 ; H01L21/311

Abstract:
The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
Public/Granted literature
- US20170315085A1 Backside CMOS Compatible BioFET With No Plasma Induced Damage Public/Granted day:2017-11-02
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