Invention Grant
- Patent Title: Apparatus and method for processing a semiconductor substrate
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Application No.: US16021619Application Date: 2018-06-28
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Publication No.: US10475668B2Publication Date: 2019-11-12
- Inventor: Andre Wedi , Guido Boenig , Niels Oeschler , Christian Stahlhut
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP17178590 20170629
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/373 ; H01L23/00 ; H01L23/492
Abstract:
A method includes placing a semiconductor substrate on a first curved surface of a first bending tool, using a second bending tool with a second surface to apply pressure to the semiconductor substrate, thereby pressing the semiconductor substrate onto the first curved surface and bending the semiconductor substrate, and removing the bended semiconductor substrate from the first bending tool.
Public/Granted literature
- US20190006193A1 Apparatus and Method for Processing a Semiconductor Substrate Public/Granted day:2019-01-03
Information query
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