Invention Grant
- Patent Title: Integrated circuit structure having dies with connectors of different sizes
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Application No.: US13270776Application Date: 2011-10-11
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Publication No.: US10475759B2Publication Date: 2019-11-12
- Inventor: Shin-Puu Jeng , Chen-Hua Yu , Jing-Cheng Lin
- Applicant: Shin-Puu Jeng , Chen-Hua Yu , Jing-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L25/11 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L25/065
Abstract:
An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface. The first die is attached to the first surface of the substrate by first electrical connectors. The second die is attached to the first surface of the substrate by second electrical connectors. A size of one of the second electrical connectors is smaller than a size of one of the first electrical connectors.
Public/Granted literature
- US20130087920A1 Integrated Circuit Structure Having Dies with Connectors of Different Sizes Public/Granted day:2013-04-11
Information query
IPC分类:
