Invention Grant
- Patent Title: Modem and RF chips, application processor including the same and operating method thereof
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Application No.: US16037024Application Date: 2018-07-17
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Publication No.: US10476547B2Publication Date: 2019-11-12
- Inventor: Jun-Ho Huh , Ho-Rang Jang , Seok-Chan Kim , In-Tae Kang , Sang-Heon Lee , Kwan-Yeob Chae , June-Hee Lee , Sang-Hune Park , Jae-Chol Lee , Hyung-Kweon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2016-0109551 20160826
- Main IPC: H03M3/00
- IPC: H03M3/00 ; H04B1/44 ; H04L27/06 ; H04L27/26 ; H04L7/04 ; H04J3/06

Abstract:
A modem chip communicates with a radio frequency (RF) chip and includes a digital interface configured to receive data including a plurality of samples from the RF chip based on digital communication. A logic block generates a frame synchronization signal based on a clock signal in the modem chip, provides the generated frame synchronization signal to the digital interface, and receives the plurality of samples in synchronization with the frame synchronization signal.
Public/Granted literature
- US10516433B2 Modem and RF chips, application processor including the same and operating method thereof Public/Granted day:2019-12-24
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