- Patent Title: Process for making a molded device assembly and printhead assembly
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Application No.: US16112966Application Date: 2018-08-27
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Publication No.: US10479086B2Publication Date: 2019-11-19
- Inventor: Chien-Hua Chen , Thomas R Strand , Michael G Groh
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; B29C69/00 ; B41J2/155 ; H05K1/18 ; H05K3/28 ; H05K3/32 ; H05K3/40
Abstract:
In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.
Public/Granted literature
- US20180361746A1 PROCESS FOR MAKING A MOLDED DEVICE ASSEMBLY AND PRINTHEAD ASSEMBLY Public/Granted day:2018-12-20
Information query
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