公开(公告)号：US20170066242A1

公开(公告)日：2017-03-09

申请号：US15308562

申请日：2014-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua CHEN ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  H05K3/28 ,  H05K1/18 ,  B41J2/14 ,  H05K3/32

CPC classification number: B41J2/1632 ,  B29C69/001 ,  B41J2/14016 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Abstract translation: 在一个示例中，用于制造微器件组件的方法包括将微器件放置在印刷电路板的前部上，在围绕微器件的印刷电路板上模制成型，然后在微型器件上形成通道 印刷电路板的背面部分。

公开(公告)号：US10232621B2

公开(公告)日：2019-03-19

申请号：US15308562

申请日：2014-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  B29C69/00 ,  H05K3/40

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

公开(公告)号：US10479086B2

公开(公告)日：2019-11-19

申请号：US16112966

申请日：2018-08-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/14 ,  B29C69/00 ,  B41J2/155 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

公开(公告)号：US20180361746A1

公开(公告)日：2018-12-20

申请号：US16112966

申请日：2018-08-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  H05K3/32 ,  H05K3/28 ,  H05K1/18 ,  B29C69/00 ,  H05K3/40

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.