公开(公告)号：US11780227B2

公开(公告)日：2023-10-10

申请号：US17312360

申请日：2019-06-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/18

CPC classification number: B41J2/1639 ,  B41J2/14016 ,  B41J2/14201 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/1625 ,  B41J2/18

Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

公开(公告)号：US20170066242A1

公开(公告)日：2017-03-09

申请号：US15308562

申请日：2014-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua CHEN ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  H05K3/28 ,  H05K1/18 ,  B41J2/14 ,  H05K3/32

CPC classification number: B41J2/1632 ,  B29C69/001 ,  B41J2/14016 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Abstract translation: 在一个示例中，用于制造微器件组件的方法包括将微器件放置在印刷电路板的前部上，在围绕微器件的印刷电路板上模制成型，然后在微型器件上形成通道 印刷电路板的背面部分。

公开(公告)号：US10232621B2

公开(公告)日：2019-03-19

申请号：US15308562

申请日：2014-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  B29C69/00 ,  H05K3/40

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

公开(公告)号：US20240100849A1

公开(公告)日：2024-03-28

申请号：US17919006

申请日：2020-04-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael G Groh ,  Bo Song

IPC: B41J2/175 ,  B41J2/16

CPC classification number: B41J2/17553 ,  B41J2/1606 ,  B41J2/1632

Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

公开(公告)号：US20220111647A1

公开(公告)日：2022-04-14

申请号：US17312360

申请日：2019-06-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/18 ,  B41J2/14

Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

公开(公告)号：US12097711B2

公开(公告)日：2024-09-24

申请号：US17919006

申请日：2020-04-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael G Groh ,  Bo Song

IPC: B41J2/175 ,  B41J2/16

CPC classification number: B41J2/17553 ,  B41J2/1606 ,  B41J2/1632 ,  B41J2/162

Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

公开(公告)号：US10479086B2

公开(公告)日：2019-11-19

申请号：US16112966

申请日：2018-08-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/14 ,  B29C69/00 ,  B41J2/155 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

公开(公告)号：US20180361746A1

公开(公告)日：2018-12-20

申请号：US16112966

申请日：2018-08-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Thomas R Strand ,  Michael G Groh

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  H05K3/32 ,  H05K3/28 ,  H05K1/18 ,  B29C69/00 ,  H05K3/40

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.