A switching amplifier includes a power device and a processing device. The power device is configured for powering a load and is comprised of a plurality of switches. The processing device configured to calculate a switch junction temperature for a bonding wire in each switch based at least in part on a power loss of each switch; generate a first accumulated fatigue damage of the bonding wire in each switch based on the switch junction temperature; and generate an estimated remaining lifetime of the switching amplifier based on the first accumulated fatigue damages of the bonding wires in each switch.